Halogen free PI reinforcing plate is made of high heat resistant and high adhesive adhesive coating on PI film substrate, and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to ensure its good adhesion on copper foil and PI material, widely used in various FPC reinforcement.
·產(chǎn)品結(jié)構(gòu)及系列Product Structure and Series
產(chǎn)品結(jié)構(gòu) Product structure | 產(chǎn)品系列 Product serides |
Pi膜 PI Film 環(huán)氧樹脂 Adhesive 離型紙 Release Paper | 環(huán)氧膠系列 Epoxy series |
·產(chǎn)品規(guī)格 Product Specifications
Item（項(xiàng)目） | Test method（測試方法） | Specification（規(guī)格） |
Width（幅寬） | Specification | 250±1mm |
PI stifferner film thickness（PI厚度） | Specification | 3-9 mil |
Adhesive thickness（膠層厚度） | Specification | 25±3um |
Shelf life（保質(zhì)期） | 25±10℃，65±20﹪RH | 12months |
·產(chǎn)品性能 Product Properties
Item（項(xiàng)目） | Test method（測試方法） | Specification（規(guī)格） | |
Adhesive flow(溢膠量) | IPC TM650 2.3.17.1 | ≦0.2mm | |
Peel strength （剝離強(qiáng)度） | As Received（直接測試） | IPC TM650 2.4.9 | ≧0.8kgf/cm |
After MEK/10min (丁酮浸泡10分鐘測試) | ≧0.8kgf/cm | ||
Solder Float Resistance（耐焊性） (after 165℃±5℃ 1hr) ( 165℃±5℃烘烤1小時后) | IPC TM650 2.4.13 | 288℃ 10sec | |
Surface Resistivity（Ω）(表面電阻率) Volume Resistivity（Ω.cm）(體積電阻率) | IPC TM650 2.5.17 IPC TM650 2.5.17 | ≧1.0*1013Ω | |
≧1.0*1015Ω.cm | |||
Insulation Resistance（Ω）(感應(yīng)電阻率) | IPC TM650 2.6.3.2 | ≧1.0*1011Ω | |
·產(chǎn)品應(yīng)用 Product Application
用于插拔金手指等部位補(bǔ)強(qiáng)。
The product is mainly used to reinforce parts such as gold finger.